Sensing and 3D mapping of soil compaction

dc.contributor.buuauthorTekin, Yücel
dc.contributor.buuauthorKul, Basri
dc.contributor.buuauthorOkursoy, Rasim
dc.contributor.departmentUludağ Üniversitesi/Teknik Bilimler Meslek Yüksekokulu/Makine ve Metal Teknolojileri Bölümü.tr_TR
dc.contributor.researcheridJ-3560-2012tr_TR
dc.contributor.scopusid15064756600tr_TR
dc.contributor.scopusid24338263900tr_TR
dc.contributor.scopusid6506218306tr_TR
dc.date.accessioned2022-06-23T11:55:09Z
dc.date.available2022-06-23T11:55:09Z
dc.date.issued2008-05
dc.description.abstractSoil compaction is an important physical limiting factor for the root growth and plant emergence and is one of the major causes for reduced crop yield worldwide. The objective of this study was to generate 2D/3D soil compaction maps for different depth layers of the soil. To do so, a soil penetrometer was designed, which was mounted on the three-point hitch of an agricultural tractor, consisting of a mechanical system, data acquisition system (DAS), and 2D/3D imaging and analysis software. The system was successfully tested in field conditions, measuring soil penetration resistances as a function of depth from 0 to 40 cm at 1 cm intervals. The software allows user to either tabulate the measured quantities or generate maps as soon as data collection has been terminated. The system may also incorporate GPS data to create geo-referenced soil maps. The software enables the user to graph penetration resistances at a specified coordinate. Alternately, soil compaction maps could be generated using data collected from multiple coordinates. The data could be automatically stratified to determine soil compaction distribution at different layers of 5, 10,...., 40 cm depths. It was concluded that the system tested in this study could be used to assess the soil compaction at topsoil and the randomly distributed hardpan formations just below the common tillage depths, enabling visualization of spatial variability through the imaging software.en_US
dc.identifier.citationTekin, Y. vd. (2008). "Sensing and 3D mapping of soil compaction". Sensors, 8(5), 3447-3459.en_US
dc.identifier.endpage3459tr_TR
dc.identifier.issn1424-8220
dc.identifier.issue5tr_TR
dc.identifier.pubmed27879888tr_TR
dc.identifier.scopus2-s2.0-44649114625tr_TR
dc.identifier.startpage3447tr_TR
dc.identifier.urihttps://doi.org/10.3390/s8053447
dc.identifier.urihttps://www.mdpi.com/1424-8220/8/5/3447
dc.identifier.urihttp://hdl.handle.net/11452/27372
dc.identifier.volume8tr_TR
dc.identifier.wos000257248800032
dc.indexed.pubmedPubMeden_US
dc.indexed.scopusScopusen_US
dc.indexed.wosSCIEen_US
dc.language.isoenen_US
dc.publisherMDPIen_US
dc.relation.journalSensorsen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergitr_TR
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectGPSen_US
dc.subjectPenetration resistanceen_US
dc.subjectSoil compactionen_US
dc.subjectSoil mappingen_US
dc.subjectAgricultureen_US
dc.subjectGlobal positioning systemen_US
dc.subjectSoftware testingen_US
dc.subjectSoilsen_US
dc.subjectData acquisition systemen_US
dc.subjectMechanical systemsen_US
dc.subjectPenetration resistancesen_US
dc.subjectRandomly distributeden_US
dc.subjectSoil compactionen_US
dc.subjectSoil mappingen_US
dc.subjectSoil penetration resistanceen_US
dc.subjectSpatial variabilityen_US
dc.subjectSoil mechanicsen_US
dc.subjectPenetration resistanceen_US
dc.subjectSpatial variabilityen_US
dc.subjectPhysical-propertiesen_US
dc.subjectSubsoil compactionen_US
dc.subjectFielden_US
dc.subjectYielden_US
dc.subjectPenetrometeren_US
dc.subjectPredictionen_US
dc.subjectGrowthen_US
dc.subjectWheaten_US
dc.subjectChemistryen_US
dc.subjectEngineeringen_US
dc.subjectInstruments & instrumentationen_US
dc.subject.scopusDraft Forces; Moldboard Plows; Subsoilingen_US
dc.subject.wosChemistry, analyticalen_US
dc.subject.wosEngineering, electrical & electronicen_US
dc.subject.wosInstruments & instrumentationen_US
dc.titleSensing and 3D mapping of soil compactionen_US
dc.typeArticle
dc.wos.quartileQ2 (Chemistry, analytical)en_US
dc.wos.quartileQ1 (Instruments & instrumentation)en_US

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